Contact Plating:
Height Seated (Max):
Hysteresis:
JESD-30 Code:
JESD-609 Code:
Max Operating Temperature:
Max Power Dissipation:
Min Operating Temperature:
Moisture Sensitivity Level (MSL):
Natural Thermal Resistance:
Number of Circuits:
Number of Elements:
Number of Functions:
Number of Pins:
Number of Terminations:
Operating Supply Current:
Operating Supply Voltage:
Packing Method:
Peak Reflow Temperature (Cel):
Pin Count:
Power Dissipation:
Power Supply Rejection Ratio (PSRR):
Propagation Delay (Max):
Supply Current-Max:
Supply Voltage Limit-Max:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Time@Peak Reflow Temperature-Max (s):
Dual Supply Voltage:
RFQ
BOM